|
Physical Properties |
Value |
Units |
Test Method |
|
Bulk Thermal Conductivity |
90 ± 10 ± 10 ± 10 ± 10 ± 10 (275 kPa/40 psi) |
W/mK |
ASTM D5470 |
|
Effective Thermal Resistance |
5.5 ± 0.5 ± 0.5 ± 0.5 ± 0.5 ± 0.5 ± 0.5 (275 kPa/40 psi, 200μm) |
Kmm2/W |
ASTM D5470 |
|
Thickness Range for Production |
0.15 - 2.0 |
mm |
|
|
Thickness Tolerance |
<10 |
% |
|
|
Pad Size |
Up to 80 * 80 |
mm 2 |
|
|
Pressure Response at 50% Com-pression |
850±100 (123±14) @200μm pad |
kPa (psi) |
ASTM D575 |
|
Recovery |
> 70 |
% |
|
|
Tensile strength |
> 50 (7) |
kPa (psi) |
ASTM D412 |
|
Flammability |
V - O |
|
UL94 |
|
Surface Roughness (Ra) |
2 ± 1 |
μm |
ISO 25178 |
|
Surface Roughness (Rz)/td> |
30 ± 10 |
μm |
ISO 25178 |
|
Color |
Grey |
- |
Visual |
GT-TIM is a protected trademark of Smart High Tech
Features:
- High Thermal Conductivity
- Low Effective Thermal Resistance
- High Compressibility and Ultra Light
Applications:
Cooling of Al modules, 5G devices, Thermal Burn-In, IC Thermal testing, GPU, CPU, RF, Opto module, IGBT, LED and Power modules
Description:
GT90PRO is a graphene enhanced thermal interface material. It has very low effective thermal resistance (5.5 Kmm2/W at 275 kPa at 200 μm). Moreover, the GT90PRO has advantages of low density, low complexity during assembly and good maintainability. GT90PRO opens new opportunities for addressing large heat dissi- pation issues in electronics and other high power driven systems.
※【法人様限定販売】商品となります。
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