The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The nickel-plated surface of the Intel High Performance Heatspreader V1 is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler so that liquid metal does not diffuse into the copper and alloy formation is minimized. This means that multiple applications of liquid metal are generally not necessary.