| Dimension | 81.00 x 80.00 x 68.00 mm |
| Weight | 700±5g |
| Material | Copper Heat Sink with Heat Pipes embedded |
| Fan | 6025 Side-blow fan with PWM Function |
| Mounting Method | Cooler Mounted in Captive design |
| Back Strip Set | Included |
| Thermal Grease | Shin-Etsu G751 Pre-printed |
| TDP | Up to 165 Watts |
| CPU Support
|
Intel |
| CPU Socket | Socket LGA 115X/1200 |
| Weight | 700 ± 5 g |
| Material | Copper Heatsink with Heat Pipes |
| Solution | 2U Server and Up |
| Dimensions | 81.0 x 80.0 x 68.0 mm |
| Fan Dimension | 60 x 60 x 25 mm |
| Rated Voltage | 12V |
| Bearing | 2 Ball Bearing |
| Speed | At Duty Cycle 20%: 1700 ± 200 RPM At Duty Cycle 50%: 4000 ± 10% RPM At Duty Cycle 100%: 8000~8500 RPM |
| Power | At Duty Cycle 20%: 1.2 W At Duty Cycle 50%: 2.5 W At Duty Cycle 100%: 9.6 W |
| Air Flow | At Duty Cycle 0~20%: 9.86 CFM At Duty Cycle 50%: 23.21 CFM At Duty Cycle 100%: 49.32 CFM |
| Air Pressure |
At Duty Cycle 0~20%: 0.86 mm-H2O |
| Rated Static Pressure | At Duty Cycle 0~20%: 0.75 mm-H2O At Duty Cycle 50%: 1.55 mm-H2O At Duty Cycle 100%: 7.32 mm-H2O |
| Acoustical Noise | At Duty Cycle 0~20%: 19.32 dBA At Duty Cycle 50%: 37.89 dBA At Duty Cycle 100%: 54.26 dBA |
| Lead Wir Pin Out | Pin1- (-) Pin2- (+) Pin3- (Techometer/Signal output) Pin4- (PWM) |
All product specifications and product images are subject to change without notice.
Model Number: K668
Socket LGA 115X/1200
- Recommend for Intel® CPU as following
･Intel® Xeon® Processor E3 v4 Family, Socket FCLGA 1150
･Intel® Xeon® E Processor/Intel Core™ i7 Processor, Socket FCLGA 1151;
･Intel® Xeon® Processor E3 Family/Intel Core™ i5 Processor, Socket LGA 1155;
･Intel® Xeon® processor X3400, Socket LGA 1156;
･Intel® Core™ i9 Processor, Socket FCLGA 1200;
- Active Cooler for 2U Server & Up
- Support CPU Power up to 165 Watts Heat Dissipation
Tags: K668, Dynatron, 2U, LGA 1150, LGE1151, LGE1155, LGE1156, LGA1200, CPU Cooler